8 800 1000 321 - контакт центр

Корпуса электронных компонентов

Компоненты для поверхностного монтажа (SMD)

BGA (Ball Grid Array)

D-PAK, D2PAK (Decawatt, Double Decawatt Package)

DFN (Dual Flat No-lead)

DO-SMD (Diode Outline)

EQFP (Enhanced Quad Flat Pack)

HSOP (Heatsink Small Outline Package)

HSSOP (Heat Slug up Small Outline Package)

HTQFP (Heatsink Thin Quad Flat Package)

HTSSOP (Heatsink Thin Shrink Small Outline Package)

LFCSP (Lead Frame Chip Scale Package)

LFPAK (Loss Free PAcKage)

LGA (Land Grid Array)

LQFP (Low profile Quad Flat Package)

MQFP (Metric Quad Flat Package)

MSOP (Mini Small Outline Package)

PLCC (Plastic Leaded Chip Carrier)

PowerSO (Power Small Outline package)

PQFN (Plastic Quad Flat No-lead)

PQFP (Plastic Quad Flat Package)

QFN (Quad Flat No-lead)

QFPH (Quad Flat Package with Heatsink)

QSOP (Quarter Size Outline Package)

SMDIP (SMD Dual In-line Package)

SOD (Small Outline Diode)

SOIC (Small Outline Integrated Circuit)

SOIC W(Small Outline Integrated Circuit Wide body)

SON (Small Outline No-lead)

SOT (Small-Outline Transistor)

SSOP (Shrink Small Outline Package)

TO-SMD (Transistor Outline - SMD)

TQFN(Thin Quad Flat No-lead)

TQFP (Thin Quad Flat Package)

TSOP (Thin Small Ouline Package)

TSOT (Thin Small-Outline Transistor)

TSSOP (Thin Shrink Small Outline Package)

VQFN (Very thin Quad Flat No-lead)

VQFP (Very Quad Flat Package)

VSSOP (Very Shrink Small Outline Package)

...

WQFN (Very Very thin Quad Flat No-lead)

Компоненты для монтажа в отверстие (Through-hole)

Cиловые компоненты

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