8 800 1000 321 - контакт центр

Корпуса электронных компонентов

Компоненты для поверхностного монтажа (SMD)

BGA (Ball Grid Array)

D-PAK, D2PAK (Decawatt, Double Decawatt Package)

DO-SMD (Diode Outline)

HSOP (Heatsink Small Outline Package)

HTSSOP (Heatsink Thin Shrink Small Outline Package)

LFCSP (Lead Frame Chip Scale Package)

LQFP (Low profile Quad Flat Package)

MQFP (Metric Quad Flat Package)

MSOP (Mini Small Outline Package)

PLCC (Plastic Leaded Chip Carrier)

PQFN (Plastic Quad Flat No-lead)

PQFP (Plastic Quad Flat Package)

QFN (Quad Flat No-lead)

QSOP (Quarter Size Outline Package)

SMDIP (SMD Dual In-line Package)

SOD (Small Outline Diode)

SOIC (Small Outline Integrated Circuit)

SOIC W(Small Outline Integrated Circuit Wide body)

SON (Small Outline No-lead)

SOT (Small-Outline Transistor)

SSOP (Shrink Small Outline Package)

TQFN(Thin Quad Flat No-lead)

TQFP (Thin Quad Flat Package)

TSOP (Thin Small Ouline Package)

TSSOP (Thin Shrink Small Outline Package)

VQFN (Very thin Quad Flat No-lead)

VQFP (Very Quad Flat Package)

VSSOP (Very Shrink Small Outline Package)

Компоненты для монтажа в отверстие (Through-hole)

CDIP (Ceramic Dual In-line Package)

DIP (Dual In-line Package)

DO (Diode Outline)

HSIP (Heat dissipating Single In-line Package)

HZIP (Heat dissipating Zigzag In-line Package)

SDIP (Shrunk Dual In-line Package)

SIP (Single In-line Package)

TO (Transistor Outline)

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